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NCL30051
Table 2. MAXIMUM RATINGS (Notes 1 and 2)
Rating
High Voltage Input Voltage
High Voltage Input Current
Supply Input Voltage
Supply Input Current
Oscillator Input Voltage
Oscillator Input Current
Bandgap Reference Decoupling Output Voltage
Bandgap Reference Decoupling Output Current
PFC Feedback Voltage Input Voltage
PFC Feedback Voltage Input Current
PFC Current Sense Input Voltage
PFC Current Sense Input Current
PFC Zero Current Detection Input Voltage
PFC Zero Current Detection Input Current
PFC Control Input Voltage
PFC Control Input Current
PFC On Time Control Input Voltage
PFC On Time Control Input Current
PFC Drive Signal Voltage
PFC Drive Signal Current
Half ? Bridge Low Side Driver Input Voltage
Half ? Bridge Low Side Driver Input Current
Half ? Bridge High Side Driver Source Connection Input Voltage
Half ? Bridge High Side Driver Source Connection Input Current
Half ? Bridge High Side Driver Input Voltage
Half ? Bridge High Side Driver Input Current
Half ? Bridge High Side Driver Charge Pump Input Voltage
Half ? Bridge High Side Driver Charge Pump Input Current
High Side Boost Circuit Supply Voltage (between HBoost and HVS pins)
High Side Boost Circuit Supply Voltage (between HBoost and HVS pins)
Half ? Bridge High Side Driver Source Connection Slew Rate
Junction Temperature (Biased)
Storage Temperature Range
Power Dissipation (T A = 25 ° C, 1 Oz Cu, 0.155 Sq Inch, Printed Circuit Copper Clad)
Symbol
V HV
I HV
V CC
I CC
V OSC
I OSC
V REF
I REF
V PFB
I PFB
V PCS
I PCS
V PZCD
I PZCD
V PControl
I PControl
V PCT
I PCT
V PDRV
I PDRV
V HDRVlo
I HDRVlo
V HVS
I HVS
V HDRVhi
I HDRVhi
V HBoost
I HBoost
V HBoost(supply)
I HBoost(supply)
dV HVS /dt
T J
T stg
P D
Value
? 0.3 to 600
10
? 0.3 to 20
10
? 0.3 to V REF
10
? 0.3 to 9
10
? 0.3 to 10
10
? 0.3 to 10
10
? 0.3 to 10
10
? 0.3 to V REF
1.2
? 0.3 to V REF
9
? 0.3 to V CC
100
? 0.3 to V CC
100
? 1.0 to 600
100
? 1.3 to V HVS +V CC
100
? 0.3 to V HVS +V CC
100
? 0.3 to V CC
100
50
150
–60 to 150
0.95
Unit
V
mA
V
mA
V
mA
V
mA
V
mA
V
mA
V
mA
V
mA
V
mA
V
mA
V
mA
V
mA
V
mA
V
mA
V
mA
V/ns
° C
° C
W
D Suffix, Plastic Package Case 751B ? 05 (SOIC ? 16)
Thermal Resistance, Junction to Ambient
(1 Oz Cu, 0.155 Sq Inch, Printed Circuit Copper Clad)
R θ JA
130
° C/W
D Suffix, Plastic Package Case 751B ? 05 (SOIC ? 16)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device(s) contains ESD protection and exceeds the following tests:
Pins 1, 14, 15 and 16 rated to the maximum voltage of the respective pins based on the maximum ratings table.
All Other Pins: Human Body Model 1500 V per JEDEC Standard JESD22 ? A114E.
All Other Pins: Machine Model 150 V per JEDEC Standard JESD22 ? A115 ? A.
2. This device contains Latch ? Up protection and exceeds ± 100 mA per JEDEC Standard JESD78.
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